South Korea focuses on developing advanced semiconductor packaging technology...to invest 100 billion won over five years

As the miniaturization of semiconductors approaches its limits, the South Korean government will focus on developing advanced packaging technology to improve semiconductor performance. The Ministry of Science, Technology, Information and Communications announced on November 30th that the
The company announced that it will invest more than 100 billion won (approximately 11.3 billion yen) to develop a new research and development business related to advanced semiconductor packaging.
On this day, the ministry toured LG Innotek's advanced semiconductor packaging substrate manufacturing factory in Seoul, and then
A roundtable meeting was held with experts from the Japan Industry-Academia-Research Association (Industry-Academia-Research Association). The ministry announced at a conference that it will promote R&D, human resource development, and international cooperation projects to secure source technology related to advanced packaging.
did. This business offers 3D lamination, high efficiency/fine pitch packaging, high heat dissipation packaging structures, next generation interposers, ultra-fine substrates, and source technologies for substrate processes.
The goal is to secure it. The company also plans to separately promote a project to develop master's and doctoral level professional human resources specializing in the field of advanced packaging.
Mr. Lee said, ``Advanced packaging is a core technology that addresses the limits of semiconductor miniaturization, and competitive countries are already
Recognizing the importance of semiconductor technology, we are actively investing at the national level,'' and added, ``We will strive to increase the competitiveness of semiconductor technology through active investment in next-generation promising technologies.''