The company announced that it will cooperate with local research institutes such as Huawei Technologies Co., Ltd. in semiconductor research and development (R&D) and plans to invest 3.87 billion dollars (USD, approximately 586.8 billion yen) in the venture.
The company said, "The Indiana plant will begin mass-producing AI memory products, such as next-generation high-bandwidth memory (HBM), from the July-December quarter of 2028.
"In particular, we will take the lead in responding to the revitalization of the global AI semiconductor market," he said. As the AI market has become more active since last year, the demand for high-performance memory such as HBM and the importance of advanced packages have increased.
The company is believed to have sought to secure production capacity in response to the growing need for new plants. The reason the company chose Indiana as the location for its factory from among a number of other candidate locations was due to the state government's investment.
The fact that Purdue University, which is famous for its research in semiconductors and other engineering, is located in the area also played a major role in the decision.
According to the company, it is the first in the industry to build an advanced packaging factory for AI in the United States.
2024/04/08 09:33 KST
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