NVIDIA unveils new GPU ”Rubin” with 12 HBM chips ... SK and Samsung's benefits expected to continue

NVIDIA CEO Jensen Huang announced the launch of Rubin, a new graphics processing unit (GPU) with up to 12 HBM (high-bandwidth memory).
The announcement comes just three months after Blackwell revealed its GPU roadmap in March, which is set to launch in the second half of the year.
Therefore, Rubin, which can be said to be the next generation GPU, is scheduled to be equipped with the most HBM ever, and it is expected that Korean companies such as SK Hynix and Samsung Electronics will continue to benefit.
On the 2nd, Fan revealed details of the new GPU, Rubin, during a keynote speech at the Taipei International Computer Show (Computex Taipei), held at the National Taiwan University Sports Center in Taipei, Taiwan.
According to Fan, the Rubin GPU is expected to have eight sixth-generation HBM4 chips, while the Rubin Ultra GPU will have 12 HBM4 chips, and both are expected to be released next year.
South Korean companies Samsung Electronics and SK Hynix have set the goal of developing and mass-producing HBM4 next year in their published roadmaps.
HBM is a high-value-added memory that stacks multiple DRAMs vertically to significantly improve data processing performance. This is NVIDIA's GPU performance
It is essential to maximize the performance of the chip and plays a central role in AI semiconductors. For this reason, it is installed next to the GPU in AI semiconductors.
In March of this year, NVIDIA announced its next-generation GPU, Blackwell, which is scheduled to be released in the second half of this year.
Since it was announced ahead of the release of the next-generation product, it can be called the next-generation GPU. In addition, Fan also announced the Blackwell GPU, an upgraded version of the Blackwell GPU, on the same day.
Samsung Electronics announced that the Well Ultra GPU will be equipped with eight 12-layer HBM3E. Samsung Electronics is currently working with NVIDIA to conduct quality testing of the 12-layer HBM3E, and is expected to deliver the product in the first half of the year.
Mass production is scheduled to begin in the third quarter. SK Hynix is also reportedly planning to release 12-layer HBM3E products in the third quarter.
SK Hynix has already released its GPU launch roadmap for next year,
According to market research firm TrendForce, HBM's share of global DRAM sales rose 1.2% from last year to 1.6% from last year.
It is expected to grow from 8% to 21% this year and surpass 30% by 2025.