Samsung and SK to promote collaboration with other companies as customized semiconductor products become mainstream (South Korea)

Samsung Electronics has announced that it is preparing to commercialize customized high-bandwidth memory (HBM) for multiple customers.
In particular, from the next-generation product HBM4, the base die will combine the graphics processing unit (GPU) and HBM.
In order for SK Hynix to manufacture customized products after HBM4, it has partnered with Taiwan's leading foundry (semiconductor contract manufacturing)
This is why Samsung Electronics decided to collaborate with TSMC. Kim Jaejung, vice president of the memory business division at Samsung Electronics, said, "At HBM, responding to customer needs is important, so we decided to collaborate with TSMC.
"We will flexibly select foundry operators who will be the toners, regardless of whether they are inside or outside the group," he said. In artificial intelligence (AI) semiconductors, customized products are more important than mass production.
The development of AI will require all-round cooperation in the industrial sector to bring about technological innovation. SK Group Chairman Chey Tae-won said, "We will make up for the shortcomings of SK.
"We are working with partner companies in each field to achieve this goal," he said. An industry insider said, "We will change the industry's current trend and shift to a mindset of providing customer service.
"This is what is needed by semiconductor businesses," he said.