LG Chem and Noritake develop silver paste for bonding SiC power semiconductors for automobiles - South Korean media

Chemical giant LG Chem has jointly developed with its Japanese competitor Noritake a silver paste (conductive adhesive) to bond SiC power semiconductor (SiC silicon carbide semiconductor) chips to substrates.
The silver paste developed this time is a high-performance adhesive containing silver nanoparticles. It was developed by combining LG Chem's particle design technology and Noritake's particle dispersion technology, and has excellent properties.
The silver paste is characterized by its excellent heat resistance and heat insulation properties. Existing silver pastes need to be stored frozen and have a short shelf life, making them difficult to manage.
The products can be stored at room temperature for long periods, improving the efficiency of transportation and storage. With the development of electric vehicles and autonomous driving technology, the demand for power semiconductors that can handle high voltage currents is rapidly increasing.
The previously used SOLUDA ring (solder) caused problems when the operating temperature of power semiconductors reached a maximum of 300 degrees. This created a need for adhesives that could maintain stable performance even at high temperatures.
The silver paste market for automotive power semiconductors is expected to reach approximately 300 billion won (approximately 316 billion yen) in 2025.
It is expected to grow from the current 2017 market cap of 1.56 billion won (approximately 89.67 billion yen) to 850 billion won (approximately 89.67 billion yen) in 2030.