Samsung Electro-Mechanics to increase production of AI-related semiconductors, aim to double sales (South Korea)

Electronic parts manufacturer Samsung Electro-Mechanics has recently begun mass production of semiconductor package substrates for artificial intelligence (AI) PCs. The products will be provided to major North American semiconductor companies.
The company has secured a contract with the AI PC manufacturer and its semiconductor package substrates have been evaluated by business partners. The company plans to apply and expand the use of AI PC semiconductor package substrates to a variety of products, including smartphones and servers, in addition to AI PCs.
The company plans to supply AI server products during the July-December period of this year. Se Jeong and Busan are
The plan is to make it a core base for the production of semiconductor package substrates for PCs. The Sejong facility is a manufacturing base for general semiconductor package substrates for AI.
The construction of a new factory is underway, aiming for completion by the end of the June quarter, which will increase production capacity for next-generation substrates that utilize miniaturization processes.
The company plans to invest 1.9 trillion won (approximately 211.288 billion yen) in FC-BGA in 2021.
The company announced that it will expand its production lines and is working to increase its AI sales through this strategy. An industry source said, "In addition to recruiting circuit board experts, we are also working with Sejong City and Bucheon.
This is a move that shows the company is getting serious about the AI market, centering on its base in Yamaguchi."